Diffusion bonding technology

Diffusion bonding is a solid state joining process first developed for commercial use by Heatric in the early 1980s which allows for the creation of compact heat exchangers with exceptionally high performance.

This process involves the bonding of flow plates present in a Heatric exchanger 'stack' using a high temperature, high pressure process with no melting or deformation of channels ensuring flow integrity and complete bonding of all plates throughout the stack.

The interfacial area between two metal flow plates becomes welded together as atoms intertwine with one another and this allows for the incredibly precise construction of the internal flow passages within the block.

No brazing flux or filler is used in the diffusion bonding manufacturing process which acts by generating metal grain growth between the upper and lower surfaces of each plate.

As a result, this creates an extremely high-integrity solid block of the parent metal which contains the ‘internally bound’ flow channels running throughout the core of the block.

This solid, diffusion bonded block can then be subtractively engineered to match your exact size and weight requirements, providing you with a highly effective, bespoke heat exchanger.


TSize and weight comparison betwewen PCHE vs shell and tube modelhis innovative manufacturing process allows for substantial improvements in the way a heat exchanger operates:

  • Massive reductions in size - up to 80% smaller than conventional exchangers
  • Extreme high pressure capabilities - Heatric PCHEs are able to withstand pressures over 600 bar (equivalent to 9,000 psi)
  • Operational under temperatures ranging between deep cryogenic to over 900°C/1,600°F.
  • High structural integrity due to the sold state construction method employed


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